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Call for Papers

[ Call for Papers as PDF file ]

Background: Application domains have had a considerable impact on the evolution of embedded systems, in terms of required methodologies and supporting tools and resulting technologies. SoCs are slowly making inroads in to the area of industrial automation to implement complex field-area intelligent devices which integrate the intelligent sensor/actuator functionality by providing on-chip signal conversion, data processing, and communication functions. There is a growing tendency to network field-area intelligent devices around industrial type of communication networks. Similar trends appear in the automotive electronic systems where the Electronic Control Units (ECUs), typically implemented as heterogeneous system-on-chip, are networked by means of one of safety-critical communication protocols such as FlexRay, for instance, for the purpose of controlling one of vehicle functions; electronic engine control, ABS, active suspension, etc. The design of this kind of networked embedded systems (this includes also hard real-time industrial control systems) is a challenge in itself due to the distributed nature of processing elements, sharing common communication medium, and safety-critical requirements, to mention some.

Aim: The aim of the symposium is to bring together researchers and practitioners from industry and academia and provide them with a platform to report on recent developments, deployments, technology trends and research results, as well as initiatives related to embedded systems and their applications in a variety of industrial environments.

Topics include, but are not limited to:

  • Embedded Systems: Design and Validation of Embedded Systems; Real-Time Issues; Models of Embedded Computation; Design and Verification Languages; Operating Systems and Quasi-Static Scheduling; Timing and Performance Analysis; Power Aware Embedded Computing; Adaptive Embedded Systems; Security in Embedded Systems.

  • System-on-Chip and Network-on-Chip Design & Testing: Design of Application-Specific Instruction-Set Processors; Design and Programming of Embedded Multiprocessors; SoC Communication and Architectures; NoC Communication and Architectures; Design of SoC/NoC; Platform-Based Design for Embedded Systems; Reconfigurable Platforms; Multiprocessor SoC Platforms and Tools; Testing of Embedded Core-based Integrated Circuits.

  • Networked Embedded Systems: Design Issues for Networked Embedded; Middleware Design and Implementation for Networked Embedded Systems; Self Adaptive Networked Entity Sensor Networks: Architectures, Energy-Efficient Medium Access Control, Time Synchronization Issues, Distributed Localization Algorithms, Routing, Distributed Signal Processing, Security..

  • Embedded Applications: Industrial Automation and Controls; Automotive Applications; Industrial Building Automation and Control; Power (sub-) Station Automation and Control; Intelligent Sensors, etc. - design, maintenance, fault tolerance & dependability, networks, infrastructure, safety and security.

Submission of Papers: Contributions must contain original unpublished work. Papers that have been concurrently submitted to other conferences or journals (double submissions) will be automatically rejected.

Papers are to be submitted electronically in PDF format, according to the instructions contained in the Conference web site. Two types of submissions are solicited: Long Papers - from 6 to 10 double-column pages (typically 8 pages). Work-in-Progress (WiP) Papers - limited to 4 double-column pages. For further details, please consult the conference web pages.

Further Details: SIES’2011 Symposium Secretariat (thomas.nolte@mdh.se)

Paper Acceptance: Each accepted paper must be presented at the conference by one of the authors. The final manuscript must be accompanied by a registration form and a registration fee payment proof. All conference attendees, including authors and session chairpersons, must pay the conference registration fee, and their travel expenses.


Important dates

Deadline for submission of long papers February 20, 2011 March 2, 2011
Deadline for submission of WiP papers March 20, 2011 April 3, 2011
Notification for acceptance of papers April 28, 2011
Deadline for conference registration for authors May 13, 2011
Deadline for final manuscript of papers May 8, 2011 May 20, 2011
Deadline for early registration May 27, 2011


Conference organization

SIES 2011 General Chairmen

Thomas Nolte
Mälardalen University, Sweden
Richard Zurawski
ISA Group., USA

SIES 2011 Program Chairmen

Iain Bate
University of York, UK
Roberto Passerone
University of Trento, Italy

SIES 2011 Work-in-Progress Chairmen

Marco Di Natale
Scuola Superiore S. Anna, Italy
Elisabeth Uhlemann
Halmstad University, Sweden

SIES 2011 Special Session Chair

Dejan Nickovic
IST, Austria

SIES 2011 Organizing Committee Chairmen

Hans Hansson
Mälardalen University, Sweden
Thomas Nolte
Mälardalen University, Sweden

SIES 2011 Finance Chairmen

Gunnar Widforss
Mälardalen University, Sweden
Richard Zurawski
ISA Group, USA

SIES 2011 Publication Chair

Radu Dobrin
Mälardalen University, Sweden

SIES 2011 Web Chair

Hüseyin Aysan
Mälardalen University, Sweden

SIES Series Steering Committee

Giovanni De Micheli
EPFL, Switzerland
Rolf Ernst
TU Braunschweig, Germany Rajesh Gupta
UC San Diego, USA
Alberto Sangiovanni-Vincentelli
UC Berkeley, USA
Lothar Thiele
ETHZ, Switzerland
Reinhard Willhelm
University of Saarland, Germany
Richard Zurawski
ISA Group, USA

SIES 2011 Local Organizing Team

Mikael Åsberg
Moris Behnam
Svetlana Girs
Andreas SG Gustavsson
Leo Hatvani (official SIES photographer)
Rafia Inam
Nima M. Khalilzad
Yue Lu
Farhang Nemati
Sanja Sain
Giacomo Spampinato
Daniel Sundmark
Jagadish Suryadevara
Hang Yin

SIES 2011 Technical Program Committee

Mark Bartlett
University of York, U.K.
Partha Biswas
The MathWorks, USA
Philip Brisk
UC Riverside, USA
Diego Andrade Canosa
University of Coruna, Spain
Luca Carloni
Columbia Univ., USA
Jian-Jia Chen
Karlsruhe Institute of Technology, Germany
Antonio-Marcello Coppola
ST Microelectronics, France
Robert de Simone
INRIA, France
Marco di Natale
Scuola Superiore S. Anna, Italy
Rolf Ernst
TU Braunschweig, Germany
Tullio Facchinetti
University of Pavia, Italy
António Ferrari
Universidade de Aveiro, Portugal
Franco Fummi
University of Verona, Italy
Zonghua Gu
Zhejiang University, China
Wolfgang Halang
FernUniversität Hagen, Germany
Hans Hansson
Mälardalen University, Sweden
Christian Hochberger
TU Dresden, Germany
Magnus Jonsson
Halmstad University, Sweden
Raimund Kirner
University of Hertfordshire, U.K.
Tei-Wei Kuo
Taiwan National University, Taiwan
Luciano Lavagno
Politecnico di Torino Italy & Cadence Berkeley Labs, USA
Lucia Lo Bello
University of Catania, Italy
Nicolas Navet
INRIA, France
Arnaldo Oliveira
Universidade de Aveiro, Portugal
Peter Palensky
Austrian Institute of Technology, Austria
Paulo Pedreiras
Universidade de Aveiro, Portugal
Carlos Eduardo Pereira
Univ. Fed. Rio Grande do Sul, Brazil
Stefan M. Petters
ISEP - IPP
Alessandro Pinto
UTRC, USA
Katalin Popovici
The MathWorks, USA
S. Ramesh
General Motors, India
Tanguy Risset
INRIA / ENS Lyon, France
Thilo Sauter
Austrian Academy of Sciences, Austria
Patrick Schaumont
Virginia Tech, USA
Marc Schlickling
AbsInt, Germany
Eelco Scholte
UTRC, USA
Bernhard Schätz
Fortiss GmbH, Germany
Zili Shao
Hong Kong Polytechnic University, Hong Kong
Françoise Simonot-Lion
Nancy Université – LORIA, France
Jean-Pierre Talpin
IRISA, France
Kleanthis Thramboulidis
Saarland University, Germany
Eduardo Tovar
IPP, Portugal
Sergio Yovine
CONICET-UBA, Argentina
Haibo Zeng
GM Research, USA

List of Reviewers

Luca Abeni
University of Trento, Italy
Rico Backasch
TU Dresden, Germany
Mark Bartlett
University of York, U.K.
Sanjoy K. Baruah
University of North Carolina at Chapel Hill, USA
Iain Bate
University of York, U.K.
Marko Bertogna
Scuola Superiore S. Anna, Italy
Partha Biswas
The MathWorks, USA
Philip Brisk
UC Riverside, USA
Christian Buckl
Fortiss GmbH, Germany
Sven Buente
TU Wien, Austria
Diego Andrade Canosa
University of Coruna, Spain
Luca Carloni
Columbia Univ., USA
Jian-Jia Chen
Karlsruhe Institute of Technology, Germany
Gianluca Cena
IEIIT-CNR, Italy
Antonio-Marcello Coppola
ST Microelectronics, France
Emilio Cota
Columbia University, USA
Milton Cunguara
Universidade de Aveiro, Portugal
Robert de Simone
INRIA, France
Marco di Natale
Scuola Superiore S. Anna, Italy
Radu Dobrin
Mälardalen University, Sweden
Mikael Ekström
Mälardalen University, Sweden
Rolf Ernst
TU Braunschweig, Germany
Tullio Facchinetti
University of Pavia, Italy
António Ferrari
Universidade de Aveiro, Portugal
Nathan Fisher
Wayne State University, USA
Sebastian Fishmeister
University of Waterloo, Canada
Daniele Fonantelli
University of Trento, Italy
Christian Fraboul
Toulouse University, France
Franco Fummi
University of Verona, Italy
Ambar Gadkari
General Motors, India
Zonghua Gu
Zhejiang University, China
Valerio Guarnieri
University of Verona, Italy
Wolfgang Halang
FernUniversität Hagen, Germany
Hans Hansson
Mälardalen University, Sweden
Christian Hochberger
TU Dresden, Germany
Magnus Jonsson
Halmstad University, Sweden
Albrecht Kadlec
TU Wien, Austria
Raimund Kirner
University of Hertfordshire, U.K.
Tei-Wei Kuo
Taiwan National University, Taiwan
Zhao-Rong Lai
Taiwan National University, Taiwan
Luciano Lavagno
Politecnico di Torino Italy & Cadence Berkeley Labs, USA
Changgong Li
TU Dresden, Germany
George Lima
Federal University of Bahia, Brazil
Giuseppe Lipari
Scuola Superiore S. Anna, Italy
Hung-Yi Liu
Columbia University, USA
Lucia Lo Bello
University of Catania, Italy
Patrick Loschmidt
Austrian Academy of Sciences, Austria
Jukka Mäki-Turja
Mälardalen University, Sweden
Federic Mallet
INRIA, France
Giulio Mancuso
Sant' Anna School of Advanced Studies, Italy
Yehdhih Moctar
UC Riverside, USA
Swarup Kumar Mohalik
General Motors, India
Nicolas Navet
INRIA, France
Mircea Negrean
TU Braunschweig, Germany
Vincent Nelis
CISTER / ISEP, Portugal
Thomas Nolte
Mälardalen University, Sweden
Arnaldo Oliveira
Universidade de Aveiro, Portugal
Peter Palensky
Austrian Institute of Technology, Austria
Roberto Passerone
University of Trento, Italy
Paulo Pedreiras
Universidade de Aveiro, Portugal
Marie-Agnès Peraldi-Frati
INRIA, France
Carlos Eduardo Pereira
Univ. Fed. Rio Grande do Sul, Brazil
Stefan M. Petters
ISEP - IPP
Alessandro Pinto
UTRC, USA
Katalin Popovici
The MathWorks, USA
Andreas Raabe
Fortiss GmbH, Germany
S. Ramesh
General Motors, India
Tanguy Risset
INRIA / ENS Lyon, France
Jonas Rox
TU Braunschweig, Germany
Thilo Sauter
Austrian Academy of Sciences, Austria
Bernhard Schätz
Fortiss GmbH, Germany
Patrick Schaumont
Virginia Tech, USA
Marc Schlickling
AbsInt, Germany
Eelco Scholte
UTRC, USA
Maurcie Sebastian
TU Braunschweig, Germany
Zili Shao
Hong Kong Polytechnic University, Hong Kong
Nelson Silva
Universidade de Aveiro, Portugal
Françoise Simonot-Lion
Nancy Université – LORIA, France
Giacomo Riccardo Spampinato Caponetto
Mälardalen University, Sweden
Francesco Stefanni
University of Verona, Italy
Daniel Sundmark
Mälardalen University, Sweden
Marcin Szczodrak
Colombia University, USA
Jean-Pierre Talpin
IRISA, France
Kleanthis Thramboulidis
Saarland University, Germany
Eduardo Tovar
IPP, Portugal
Elisabeth Uhlemann
Halmstad University, Sweden
Sara Vinco
University of Verona, Italy
Yu-Chen Wu
Taiwan National University, Taiwan
Young Jin Yoon
Colombia University, USA
Sergio Yovine
CONICET-UBA, Argentina
Olivier Zendra
INRIA, France
Haibo Zeng
GM Research, USA
Richard Zurawski
ISA Group., USA


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